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Semiconductor evolution: MediaTek’s 3nm Chipset and TSMC’s visionary roadmap


  • MediaTek teams with TSMC for a 3nm SoC, possibly the Dimensity 9400.

  • TSMC sets ambitious goals, aiming for 1 trillion transistors in chiplets by 2030.

  • MediaTek's chipset focuses on performance, while TSMC innovates in chip design.

The semiconductor industry is witnessing a significant evolution with MediaTek’s collaboration with TSMC to launch its first 3nm SoC, rumored to be the Dimensity 9400. Concurrently, TSMC is ambitiously planning to transform the semiconductor landscape by 2030, focusing on chiplet designs with over 1 trillion transistors.

MediaTek and TSMC’s Collaborative Effort

MediaTek’s CEO Rick Tsai recently highlighted the company’s fruitful partnership with TSMC, emphasizing their joint efforts in developing the next-generation 3nm chipset. This collaboration aims to enhance the efficiency and performance of the Dimensity 9400. While MediaTek focuses on the AI boom with its chipsets, TSMC’s expertise in efficient manufacturing processes, such as the ‘N3E’ process, plays a crucial role in optimizing the chipset’s performance, particularly in the absence of low-power cores.

Image Source: Software Plus

TSMC’s Visionary Roadmap

TSMC’s roadmap, unveiled at the IEDM 2023 conference, outlines a future dominated by advanced semiconductor processes and chiplet designs. The Taiwanese giant envisions the development of N2 and N2P processes by 2025-2027, followed by cutting-edge A10 (1nm) and A14 (1.4nm) processes by 2030. TSMC’s commitment to innovation is evident in its focus on both monolithic designs and 3D Hetero Integration (chiplet designs), projecting a shift in the industry towards more modular and cost-effective configurations.

The Shift in Semiconductor Designs

As the industry gravitates towards chiplet-based designs, TSMC is positioned as a leader in this transition. The company’s roadmap indicates a gradual move away from traditional monolithic processors, which, despite their complexity, have limitations compared to the flexibility and scalability of chiplets. This shift is further highlighted by TSMC’s goal of integrating 1 trillion transistors in chiplet designs by 2030, signifying a monumental leap in semiconductor capabilities.

The collaboration between MediaTek and TSMC, coupled with TSMC’s forward-thinking roadmap, represents a pivotal moment in the semiconductor industry. MediaTek’s focus on AI and high-performance chipsets aligns with TSMC’s innovative manufacturing processes and vision for chiplet technology. As we approach 2030, the semiconductor landscape is set to undergo a transformative change, driven by these advancements and the industry’s shift towards more versatile and efficient chip designs.