Manufacturers, system integrators, and developers seeking long-range, low-power wireless connectivity have a new option as Morse Micro begins mass production of its MM8108 Wi-Fi HaLow SoC. The company claims this device delivers robust throughput and reliable connections for a wide range of IoT applications, from industrial sensors to smart cities. With an expanded ecosystem that includes global availability of evaluation kits and development platforms, the MM8108 SoC is positioned to accelerate deployment of next-generation IoT solutions. Industry experts anticipate that these releases will simplify product design and reduce time-to-market for manufacturers aiming to capitalize on growing IoT demand.
Earlier announcements by Morse Micro focused primarily on prototype demonstrations and first-generation designs, which gained attention for their range but faced questions over integration and ecosystem support. Those releases were limited in volume and available primarily to early access partners or select developers. The recent move to mass production, along with the broader rollout of evaluation kits from Morse Micro, seems to address past concerns about scalability and commercial accessibility. Compared to prior launches, this step introduces a more complete suite of developer options and more mature module offerings from partners such as AzureWave and Vantron, signifying a shift from proof-of-concept toward mainstream adoption.
What Capabilities Does the MM8108 SoC Offer?
Morse Micro’s MM8108 Wi-Fi HaLow SoC is engineered to deliver up to 43 Mbps throughput over extended distances, targeting low-power, long-range IoT deployments. To support rapid integration, the company introduced evaluation kits including the MM8108-EKH01, MM8108-EKH05, and MM8108-EKH19, tailored for compatibility with platforms from Broadcom, ST Microelectronics, Raspberry Pi, and more. These products are now available for purchase worldwide through Mouser Electronics, facilitating immediate access for development teams. Key technical advancements, including 256QAM modulation and an enhanced internal power amplifier, set the device apart from previous iterations.
How Does Module Availability Support Developers?
Developers and OEMs now have expanded access to reference modules and solutions built on the MM8108 SoC. In addition to Morse Micro’s own MM8108-MF15457 module, alternative modules from AzureWave, Vantron, and Quectel cater to a range of customer requirements and production volumes. This diversity is expected to streamline device creation and shorten the design cycle for those integrating Wi-Fi HaLow technology. As Patrick Lin, VP of Product Marketing at AzureWave, explained,
“Our collaboration with Morse Micro on the MM8108 gives customers access to Wi-Fi HaLow performance and reliability at scale. By delivering modules built on the MM8108, we’re helping OEMs cut development time and launch the next generation of long-range, low-power IoT solutions with confidence.”
What New Platform Is Streamlining Evaluation?
Morse Micro also announced the HaLowLink 2 evaluation platform, succeeding HaLowLink 1, which supports easier adoption and prototyping of Wi-Fi HaLow networks. The updated platform, utilizing the MM8108 SoC, offers improved throughput and range, supporting faster concept-to-product workflows. HaLowLink 2 is set for general release in early 2026 in several major international markets, reflecting Morse Micro’s efforts to extend its reach and make the evaluation process more accessible. According to Michael De Nil, co-founder and CEO of Morse Micro,
“With Wi-Fi HaLow, we’re not just delivering silicon, we’re laying the foundation for IoT 2.0: an era where billions of devices can connect seamlessly, reliably, and with unprecedented throughput and range.”
Mass production and global distribution of the MM8108 Wi-Fi HaLow SoC mark a strategic move for Morse Micro, likely increasing market competition and expediting IoT innovations in various industries. While prior Wi-Fi HaLow launches addressed technical feasibility, they did not fully resolve scalability, accessible development tools, and ecosystem maturity. The latest MM8108 release, by contrast, bundles silicon advances with easier module access and a next-generation evaluation platform, thus lowering barriers for device developers. As device makers seek to build scalable, efficient, and reliable IoT infrastructures, widespread module availability and strong developer support may become crucial to driving further proliferation of Wi-Fi HaLow-based applications. Those interested in leveraging long-range, low-power connectivity will find these resources useful as entry points into an expanding IoT ecosystem.
