Manufacturers and developers worldwide are seeking efficient, integrated solutions as IoT adoption rises across industries. In response, Quectel Wireless Solutions has introduced the SRG091X and SRG093X modules during CES in Las Vegas, both engineered around NXP Semiconductors’ i.MX 9 processors and designed to address cost-sensitive segments without sacrificing versatile connectivity or performance. With the integration of Wi-Fi 6, Bluetooth 5.4, Thread, Matter, and robust multimedia features, these modules aim to streamline product design and speed up time-to-market for various industrial and consumer devices. Recent market analysis confirms a growing demand for simplified designs that still accommodate multi-protocol wireless standards, underlining the relevance of this new offering for OEMs striving to scale their connected device portfolios. Notably, Quectel’s new antennas tailored for these modules offer enhanced compatibility and wireless performance, contributing to a more straightforward path from prototype to deployment.
Earlier IoT module launches from other manufacturers often prioritized either high-end processing or basic connectivity, but rarely unified the latest wireless standards and multimedia capabilities in an entry-level package. These previous products typically required more discrete components, resulting in higher design complexity and extended R&D cycles. By leveraging the energy efficiency of NXP’s i.MX processors and unifying multiple wireless protocols, Quectel’s new modules put advanced features within reach for developers in competitive markets, a contrast to the limited integration options offered in older solutions.
What Makes SRG091X and SRG093X Stand Out?
The SRG091X series relies on the NXP i.MX 91 processor, paired with the IW610G chipset, which introduces Wi-Fi 6 across both 2.4GHz and 5GHz bands, Bluetooth BLE 5.4, and 802.15.4 (Thread/ZigBee) support as well as Matter protocol compatibility. For memory, this module includes 1GB LPDDR4 and 8GB eMMC, supporting operating systems like Linux, Zephyr, or freeRTOS. Its array of interfaces—ranging from 24-bit parallel RGB video output to dual 1Gbps ethernet—enables manufacturers to target applications including industrial HMIs, smart speakers, point-of-sale systems, and residential smart locks or doorbells.
How Does the SRG093X Expand Capabilities?
Building upon SRG091X’s foundation, the SRG093X features the NXP i.MX 93 processor with a dual-core Arm Cortex-A55 and an additional Cortex-M33 microcontroller, offering greater computational power, higher base frequencies, and enhanced uC functionality. The module’s upgraded memory—1GB LPDDR4X and 16GB eMMC—along with broad video interface options such as LVDS, RGB, and MIPI_DSI, address more demanding industrial edge applications where deep learning and advanced multimedia processing are required.
How Do These Modules Support Rapid Deployment?
To complement both the SRG091X and SRG093X, Quectel has also developed antennas optimized for the supported frequency bands and deployment scenarios, aiming to eliminate obstacles in wireless integration and improve signal reliability in diverse environments. According to Quectel’s Deputy General Manager Delbert Sun:
“The SRG091X and SRG093X series modules are designed to provide high-performance processing power for industrial, multimedia and consumer applications.”
The company emphasizes the importance of having a robust interface selection and rich multimedia support to help manufacturers quickly develop connected devices for a variety of visual and non-visual applications.
Both modules maintain a compact footprint of 46mm x 41.5mm x 3.0mm and sustain stable operation between -40°C and +85°C, serving environments from factory floors to outdoor smart infrastructure. Another statement from the company highlights:
“The modules offer Wi-Fi 6, Bluetooth 5.4 and 802.15.4(Thread/ZigBee) connectivity along with a vast choice of interfaces, especially for video-based use cases. This new generation of modules brings powerful processing and multimedia capabilities to use cases across IoT and we look forward to seeing the modules support customers’ innovations.”
The modules’ ability to integrate multi-protocol radio connectivity and processing resources into a single component aligns with the broader industry migration from Ethernet-based designs to more versatile, wireless-led architectures. Companies targeting cost-competitive markets can capitalize on the simplified bill of materials and streamlined design process. The modular approach, with a focus on supporting both entry-level and high-demand device categories, may reduce development times and lower barriers to adopting new wireless standards. OEMs and system integrators should evaluate how the SRG091X and SRG093X compare to their existing solutions in terms of flexibility, integration cost, and support for future-proof wireless protocols. By informing design decisions early, product teams can better align their development efforts with shifting market expectations and technological capabilities.
