At the upcoming Embedded World China 2024, SECO aims to redefine technological innovation with its state-of-the-art products and strategic partnerships. This event, scheduled to take place at the Shanghai World Expo Exhibition and Convention Centre from June 12-14, will see SECO unveil its latest advancements in IoT and digitalization solutions. Attendees can expect to witness firsthand the capabilities of SECO’s new offerings designed to propel the industrial landscape forward.
The Embedded World exhibition is an annual event focused on embedded systems and technologies, first launched in 2003 in Nuremberg, Germany. It serves as a platform for companies to showcase innovations in embedded hardware, software, and services. The event has since expanded to include locations such as Shanghai, emphasizing advancements in IoT, AI, and digital transformation. The latest technologies from leading tech companies are regularly featured, making it a key event for industry professionals.
During previous editions of the Embedded World, SECO has consistently presented groundbreaking technologies, enhancing their reputation in the embedded systems market. Reports from past events highlighted SECO’s role in advancing the development of efficient, high-performance computing solutions. In contrast to prior exhibitions, this year’s event emphasizes a broader range of solutions, from advanced AI-integrated systems to versatile modular designs. The evolution reflects SECO’s commitment to addressing the diverse needs of modern industrial applications.
Compared to earlier showcases, SECO now focuses more on the practical applications of their innovations. Previous exhibitions often concentrated on the technical specifications; however, this year, SECO aims to demonstrate real-world use cases and the tangible benefits of their solutions. By integrating AI and IoT technologies, SECO’s current approach is more aligned with the growing demands for intelligent, predictive, and efficient industrial solutions.
Cutting-Edge Modules and SBCs
SECO will introduce new Computer-on-Module solutions, including the SOM-SMARC-Genio700 developed with MediaTek, which offers enhanced performance and energy efficiency for various IoT applications. The booth will also showcase 13th Gen Intel® Core™ processor-equipped modules and other compact solutions like the SOM-Trizeps-VIII-MX8M-Plus. Additionally, the SBC-3.5-RK3568 single-board computer, optimized for AI and IoT, promises robust connectivity and multifunctional capabilities.
AI and Vision-Based Solutions
SECO’s range of fanless embedded computers, including the Titan 300 TGL-UP3 AI, leverage the latest Intel® SoCs and AI processors to deliver powerful edge AI solutions. The Palladio 500 RPL demo will highlight real-time AI capabilities like object recognition. SECO’s Modular Vision HMI family, with customizable screen sizes up to 4K resolution, further expands its versatile product lineup, catering to diverse industrial needs.
Technological Impacts
Key inferences from SECO’s showcase include:
– Enhanced performance and efficiency through advanced processor technologies.
– Versatile and scalable solutions for varying industrial applications.
– Integrated AI and vision systems for real-time analytics and smart operations.
– Customizable hardware and software platforms to meet specific user requirements.
SECO’s participation in Embedded World China 2024 underlines its role in driving digital transformation within the industrial sector. By offering sophisticated, next-generation technologies, SECO empowers businesses to optimize operations and innovate continuously. The focus on practical applications and real-world demonstrations showcases SECO’s commitment to delivering tangible benefits. Attendees can explore how SECO’s solutions facilitate smarter, more efficient industrial processes, marking a significant step forward in the integration of AI and IoT in the industry.
