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Reading: Telit Cinterion ME310M1-W1 IoT Module Secures US MNO Certifications
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IoT

Telit Cinterion ME310M1-W1 IoT Module Secures US MNO Certifications

Highlights

  • Telit Cinterion's ME310M1-W1 module now certified by two major US MNOs.

  • Powered by Sony’s Altair ALT1350 chipset, it supports global IoT deployments.

  • Offers flexible connectivity options, including eSIM and future satellite integration.

Ethan Moreno
Last updated: 7 January, 2025 - 8:59 pm 8:59 pm
Ethan Moreno 5 months ago
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Telit Cinterion has achieved significant progress in the IoT sector with the ME310M1-W1 module receiving certifications from two leading U.S. mobile network operators. This development not only validates the module’s performance but also paves the way for its global deployment across various industries. By integrating Sony’s Altair ALT1350 chipset, the ME310M1-W1 offers robust connectivity solutions catering to the evolving demands of IoT applications.

Contents
Global Deployment Capabilities EnhancedAdvanced Connectivity Features OfferedFuture-Proof Technology Integration

Previously, Telit Cinterion’s modules were limited in their approvals, primarily catering to specific regions or carriers. The latest certification by two prominent U.S. mobile network operators broadens the ME310M1-W1’s applicability, enhancing its suitability for a wider range of IoT deployments. This marks a notable expansion from past offerings, enabling more versatile and widespread use of the module globally.

Global Deployment Capabilities Enhanced

The certification allows IoT specialists and their clients to deploy the ME310M1-W1 module not only in the United States but also across international markets, thanks to its extensive global band support. This flexibility ensures that devices can maintain connectivity and performance standards in diverse regions, facilitating seamless global operations and expansion for IoT projects.

Advanced Connectivity Features Offered

Featuring multiple connectivity technologies, the ME310M1-W1 supports both licensed and unlicensed spectrums along with upcoming satellite connectivity within a single module. This integration enables developers to create compact, energy-efficient devices tailored to various IoT applications, such as smart utility meters and asset tracking systems, without compromising on performance or scalability.

Future-Proof Technology Integration

The inclusion of support for future 3GPP Releases 15, 16, and 17, including IoT data communication over non-terrestrial networks, ensures that the ME310M1-W1 remains adaptable to emerging standards and technologies. This forward-looking feature provides users with the confidence that their IoT solutions can transition to satellite networks when cellular coverage is unavailable, extending the module’s utility and lifespan.

“The certification of the ME310M1-W1 module by two major US mobile network operators marks a significant advancement in the IoT landscape,”

said Dima Feldman, VP Product & Marketing at Sony Semiconductor Israel.

“Our partnership with Telit Cinterion leverages the groundbreaking ALT1350 chipset to deliver a low-power, highly integrated solution that enables a new era of connected devices. With support for multiple technologies, the ME310M1-W1 empowers developers and enterprises to create innovative IoT applications that are efficient, versatile, and future-ready.”

“The global approval of the ME310M1-W1 module reinforces Telit Cinterion’s leading position in delivering advanced IoT technologies that meet our customers’ long-term needs,”

added Marco Stracuzzi, VP of Product Management, Cellular IoT at Telit Cinterion.

“With its ultra-efficient operation and flexible connectivity options, the ME310M1 supports a diverse range of global IoT applications, giving our customers confidence that their LPWA IoT solutions will seamlessly adapt to emerging connectivity standards, including 3GPP Release 17 NTN protocol and sub-1 GHz licensed and unlicensed spectrum.”

The ME310M1-W1 module’s certification by major U.S. mobile network operators underscores Telit Cinterion’s commitment to providing reliable and versatile IoT solutions. With its comprehensive connectivity options and global deployment capabilities, the module is well-suited for a variety of applications requiring long-term service and robust performance. IoT developers and enterprises stand to benefit from the module’s efficient operation and future-ready features, ensuring their projects can adapt to evolving technological landscapes and connectivity standards.

  • Telit Cinterion’s ME310M1-W1 module now certified by two major US MNOs.
  • Powered by Sony’s Altair ALT1350 chipset, it supports global IoT deployments.
  • Offers flexible connectivity options, including eSIM and future satellite integration.
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Ethan Moreno
By Ethan Moreno
Ethan Moreno, a 35-year-old California resident, is a media graduate. Recognized for his extensive media knowledge and sharp editing skills, Ethan is a passionate professional dedicated to improving the accuracy and quality of news. Specializing in digital media, Moreno keeps abreast of technology, science and new media trends to shape content strategies.
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